Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yen Ting Liu0
Harianto Wong0
Maxim Klebanov0
Paolo Campiglio0
Sundar Chetlur0
Date of Patent
April 18, 2023
0Patent Application Number
176481540
Date Filed
January 17, 2022
0Patent Citations
Patent Primary Examiner
In one aspect, a method includes forming a metal layer on a substrate, wherein the metal layer comprises a first coil, forming a planarized insulator layer on the metal layer, forming at least one via in the planarized insulator layer, depositing a magnetoresistance (MR) element on the planarized insulator layer, and forming a second coil extending above the MR element. The at least one via electrically connects to the metal layer on one end and to MR element on the other end.
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