US Patent 11641724 Conductive PVD stack-up design to improve reliability of deposited electrodes

An electronic device can include a housing component that can define an interior surface and an exterior surface of the device, a metallic film deposited on the interior surface and extending at least partially onto the exterior surface, and a ceramic film deposited on the exterior surface and at least partially over a portion of the metallic film on the exterior surface. The ceramic film can be in electrical communication with a portion of the metallic film deposited on the interior surface to form an electrical pathway from the exterior surface to the interior surface.