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US Patent 11641738 Three-dimensional semiconductor memory device
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Patent
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Date Filed
September 15, 2020
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Date of Patent
May 2, 2023
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Patent Application Number
17021416
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Patent Citations
US Patent 10354987 Three-dimensional memory device containing bonded chip assembly with through-substrate via structures and method of making the same
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US Patent 10297578 Memory device
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US Patent 11211397 Three-dimensional memory devices and methods for forming the same
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US Patent 10074667 Semiconductor memory device
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US Patent 10283493 Three-dimensional memory device containing bonded memory die and peripheral logic die and method of making thereof
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Patent Inventor Names
Byungjin Lee
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Woosung Yang
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Dong-Sik Lee
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Bumkyu Kang
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11641738
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Patent Primary Examiner
David Vu
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CPC Code
H01L 27/11551
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H01L 27/11565
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H01L 27/11573
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H01L 27/11578
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H01L 27/11582
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H01L 27/1157
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H01L 27/11563
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H01L 27/11568
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H01L 27/11519
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H01L 29/792
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