Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Mayu Felicia Yamamura0
Daniel Redfield0
Jason Garcheung Fung0
Date of Patent
May 9, 2023
0Patent Application Number
171373040
Date Filed
December 29, 2020
0Patent Citations
Patent Primary Examiner
A method of fabricating a polishing pad using an additive manufacturing system includes depositing a first set successive layers by droplet ejection to form a. Depositing the successive layers includes dispensing a polishing pad precursor to first regions corresponding to partitions of the polishing pad and dispensing a sacrificial material to second regions corresponding to grooves of the polishing pad. Removing the sacrificial material provides the polishing pad with a polishing surface that has the partitions separated by the grooves.
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