US Patent 11642847 3D build platform refill opening and cap
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Edits on 14 Aug, 2023
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Patent Inventor Names
Joan Mach0
Marius Valles0
Pau Martin Vidal0
Rafel Texido0
Edits on 10 May, 2023
Golden AI
Edits made to:
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Article (+371 characters)
US Patent 11642847 3D build platform refill opening and cap
Article
In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.
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Patent Jurisdiction
Patent Number
116428470
Date of Patent
May 9, 2023
0Patent Application Number
176806610
Date Filed
February 25, 2022
0Patent Citations
Patent Primary Examiner
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