Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hui-Jung Tsai0
Chen-Hua Yu0
Hung-Jui Kuo0
Tsao-Lun Chang0
Date of Patent
May 9, 2023
0Patent Application Number
168464130
Date Filed
April 13, 2020
0Patent Citations
Patent Citations Received
Patent Primary Examiner
A semiconductor structure includes a first substrate including a first pad thereover, a second substrate including a bump thereover and a dielectric material. The first pad includes an inner portion and an outer portion being higher than and surrounding the inner portion. The bump is bonded to the inner portion and surrounded by the outer portion. The dielectric material is disposed between the first substrate and the second substrate to encapsulate the first pad and the bump.
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