US Patent 11651611 Device mountable packaging of ultrasonic transducers
Patent 11651611 was granted and assigned to Invensense, Inc. on May, 2023 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
October 2, 2019
0
Date of Patent
May 16, 2023
0
Patent Applicant
Patent Application Number
16591166
0
Patent Citations
•••
Patent Inventor Names
Julius Ming-Lin Tsai
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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