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US Patent 11652035 Multi-pitch ball grid array

Patent 11652035 was granted and assigned to Juniper Networks on May, 2023 by the United States Patent and Trademark Office.

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A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P

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