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US Patent 11652149 Common rail contact
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Patent
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Date Filed
December 4, 2020
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Date of Patent
May 16, 2023
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Patent Application Number
17112782
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Patent Citations
US Patent 10163691 Low-K dielectric interconnect systems
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US Patent 10170322 Atomic layer deposition based process for contact barrier layer
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US Patent 10083863 Contact structure for semiconductor device
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Patent Citations Received
US Patent 12080650 Interconnect structure with low capacitance and high thermal conductivity
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Patent Inventor Names
Chen-Yuan Kao
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Yi-Ying Liu
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Li-Hsiang Chao
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Hong-Ming Wu
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Cheng-Wei Chang
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11652149
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Patent Primary Examiner
Farun Lu
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CPC Code
H01L 23/5221
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H01L 21/76877
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