Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yen-Yao Chi0
Nai-Wei Liu0
Shih-Huang Yeh0
Tzu-Hung Lin0
Wen-Sung Hsu0
Yeh-Chun Kao0
Date of Patent
May 16, 2023
0Patent Application Number
176761020
Date Filed
February 18, 2022
0Patent Citations
...
Patent Primary Examiner
A semiconductor package structure is provided. The semiconductor package structure includes a redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. An antenna structure includes a first antenna element formed in the RDL structure, a first insulating layer covering the RDL structure, a second insulating layer formed on the first insulating layer, and a second antenna element formed on and in direct contact with the second insulating layer.
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