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US Patent 11658040 Plasma processing method
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Patent
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Current Assignee
Hitachi
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Date Filed
June 26, 2019
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Date of Patent
May 23, 2023
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Patent Applicant
Hitachi
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Patent Application Number
16957878
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Patent Citations
US Patent 8501626 Methods for high temperature etching a high-K material gate structure
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US Patent 9412617 Plasma processing method and plasma processing apparatus
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11658040
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Patent Primary Examiner
Shamim Ahmed
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CPC Code
H01L 21/3086
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H01L 21/31116
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H01L 21/32137
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H01L 21/32139
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H01L 21/02274
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H01L 21/02112
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H01L 21/3065
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H01L 21/31144
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