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US Patent 11658164 Electronics card including multi-chip module

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Current Assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
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Date Filed
February 8, 2021
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Date of Patent
May 23, 2023
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Patent Application Number
17170224
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Patent Citations
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US Patent 9773757 Devices, packaged semiconductor devices, and semiconductor device packaging methods
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US Patent 10062648 Semiconductor package and method of forming the same
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US Patent 8981514 Semiconductor package having a blocking pattern between a light transmissive cover and a substrate, and method for fabricating the same
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US Patent 10008470 Embedded chip packages and methods for manufacturing an embedded chip package
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11658164
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Patent Primary Examiner
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Jasmine J Clark
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