US Patent 11658390 Wireless communications package with integrated antenna array
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US Patent 11658390 Wireless communications package with integrated antenna array
Article
Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.
Infobox
Is a
Patent Jurisdiction
Patent Number
116583900
Date of Patent
May 23, 2023
0Patent Application Number
167508610
Date Filed
January 23, 2020
0Patent Citations
Patent Primary Examiner
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