US Patent 11659312 Earphone with solid body

In an embodiment, an earphone having a solid earphone body is provided. A first mounting recess is formed in a first end of the earphone body. A first acoustic driver is disposed in the first mounting recess. At least a first sound bore is formed in the solid earphone body. The at least a first sound bore fluidly communicates with the first mounting recess and a first exit port formed at a second end of the earphone body. The second end of the earphone body is configured to be placed in an ear canal of a user. The earphone can be fabricated by a method that includes defining negative spaces for the first acoustic driver and the at least a first sound bore in a virtual model of the earphone body.