Patent attributes
A buckle assembly and an electronic device using the buckle assembly are provided. The buckle assembly is assembled in a housing of the electronic device. The housing has an inner surface and a column with a first through hole, wherein the column protrudes from the inner surface toward inside of the housing. The buckle assembly includes a fixing element, a shaft and a pair of retaining rings. The fixing element is assembled in the first through hole. The shaft is fixed in the housing. The retaining rings are pivoted to the shaft. Each of the retaining rings has an arc portion, and the retaining rings buckle each other and abut on the column. The arc portions are co-constructed to form a first hole communicating with the first through hole while the retaining rings buckle each other, and the fixing element is inserted in the first hole and column to be fixed in the housing.
