US Patent 11660359 Systems and methods for irradiation

Technology is described to uniformly apply doses of radiation to a target material. An irradiation device may comprise an enclosure configured to receive a target material and a source configured to emit primary radiation within the enclosure. The primary radiation may be configured to irradiate at least a first portion of the target material. The irradiation device may further comprise a scattering medium disposed within the enclosure. The scattering medium may be configured to produce secondary radiation through scatter interactions in response to the primary radiation, the secondary radiation configured to irradiate at least a second portion of the target material. A thickness of the scattering medium relative to the primary radiation may have a thickness of at least 3 millimeters).