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US Patent 11668601 Instrumented substrate apparatus

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
February 8, 2021
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Date of Patent
June 6, 2023
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Patent Application Number
17170361
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Patent Citations
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US Patent 9304160 Defect inspection apparatus, system, and method
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US Patent 9356822 Automated interface apparatus and method for use in semiconductor wafer handling systems
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US Patent 9719867 Method and system for measuring heat flux
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US Patent 10215626 Method and system for measuring radiation and temperature exposure of wafers along a fabrication process line
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US Patent 10460966 Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
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US Patent 10921240 High throughput analytical system for molecule detection and sensing
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US Patent 10777393 Process condition sensing device and method for plasma chamber
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US Patent 10959318 X-ray metrology system with broadband laser produced plasma illuminator
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US Patent 7135852 Integrated process condition sensing wafer and data analysis system
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US Patent 9134186 Process condition measuring device (PCMD) and method for measuring process conditions in a workpiece processing tool configured to process production workpieces
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11668601
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Patent Primary Examiner
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David P Porta
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CPC Code
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G01J 3/28
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G01J 1/429
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H01L 21/67242
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