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US Patent 11670540 Substrates including useful layers
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Patent
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Date Filed
March 2, 2021
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Date of Patent
June 6, 2023
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Patent Application Number
17190004
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Patent Citations
US Patent 7820527 Cleave initiation using varying ion implant dose
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US Patent 9696361 Method and apparatus for analyzing features or characteristics of a cable in a network
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US Patent 7110423 Method and system for source synchronous clocking
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US Patent 9628082 Strength-adjustable driver
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11670540
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Patent Primary Examiner
Ermias T Woldegeorgis
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CPC Code
H01L 21/76254
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H01L 21/76251
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H01L 21/263
0
H01L 21/324
0
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