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US Patent 11670545 Conformal low temperature hermetic dielectric diffusion barriers
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Patent
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Current Assignee
Intel
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Date Filed
June 30, 2022
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Date of Patent
June 6, 2023
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Patent Applicant
Intel
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Patent Application Number
17855656
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Patent Citations
US Patent 7473632 Semiconductor device with an air gap between lower interconnections and a connection portion to the lower interconnections not formed adjacent to the air gap
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US Patent 7576006 Protective self-aligned buffer layers for damascene interconnects
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US Patent 7830014 Method for fabricating semiconductor device and semiconductor device
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11670545
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Patent Primary Examiner
Sheikh Maruf
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CPC Code
H01L 23/5226
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H01L 23/53228
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H01L 23/564
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H01L 23/5222
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H01L 23/53295
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H01L 21/7682
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H01L 21/76829
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H01L 21/76802
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H01L 23/522
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H01L 21/02178
0
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