Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 6, 2023
0Patent Application Number
173046590
Date Filed
June 24, 2021
0Patent Citations
Patent Primary Examiner
CPC Code
A semiconductor device has a heat spreader with an opening formed through the heat spreader. The heat spreader is disposed over a substrate with a semiconductor die disposed on the substrate in the opening. A thermally conductive material, e.g., adhesive or an elastomer plug, is disposed in the opening between the heat spreader and semiconductor die. A conductive layer is formed over the substrate, heat spreader, and thermally conductive material.
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