US Patent 11670569 Channeled lids for integrated circuit packages
Patent 11670569 was granted and assigned to Intel on June, 2023 by the United States Patent and Trademark Office.
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US Patent 11670569 Channeled lids for integrated circuit packages
Article
Disclosed herein are channeled lids for integrated circuit (IC) packages, as well as related methods and devices. For example, in some embodiments, an IC package may include a die between a lid and a package substrate. A bottom surface of the lid may include a channel that at least partially overlaps the die.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
116705690
Date of Patent
June 6, 2023
0Patent Application Number
164378720
Date Filed
June 11, 2019
0Patent Citations
Patent Primary Examiner
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