Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11670603 Micro-component anti-stiction structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
July 2, 2021
0
Date of Patent
June 6, 2023
0
Patent Application Number
17366842
0
Patent Citations
‌
US Patent 8039847 Printable semiconductor structures and related methods of making and assembling
0
‌
US Patent 8506867 Printing semiconductor elements by shear-assisted elastomeric stamp transfer
0
‌
US Patent 8889485 Methods for surface attachment of flipped active componenets
0
‌
US Patent 10222698 Chiplets with wicking posts
0
‌
US Patent 10198890 Hybrid banknote with electronic indicia using near-field-communications
0
‌
US Patent 10468363 Chiplets with connection posts
0
‌
US Patent 7622367 Methods and devices for fabricating and assembling printable semiconductor elements
0
‌
US Patent 7943491 Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
11670603
0
Patent Primary Examiner
‌
Mamadou L Diallo
0
CPC Code
‌
H01L 23/58
0
‌
H01L 23/544
0
‌
H01L 2223/54426
0

Find more entities like US Patent 11670603 Micro-component anti-stiction structures

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo