US Patent 11670836 Semiconductor device package
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US Patent 11670836 Semiconductor device package
Article
A semiconductor device package includes a substrate, an air cavity, a radiator, and a director. The substrate has a top surface. The air cavity is disposed within the substrate. The air cavity has a first sidewall and a second sidewall opposite to the first sidewall. The radiator is disposed adjacent to the first sidewall of the air cavity. The director is disposed adjacent to the second sidewall of the air cavity.
Infobox
Is a
Patent Jurisdiction
Patent Number
116708360
Date of Patent
June 6, 2023
0Patent Application Number
170844870
Date Filed
October 29, 2020
0Patent Citations
Patent Primary Examiner
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