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US Patent 11675136 Optoelectronic structure
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Patent
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Date Filed
December 21, 2020
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Date of Patent
June 13, 2023
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Patent Application Number
17129644
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Patent Citations
US Patent 10295749 Optical interconnect attach to photonic device with partitioning adhesive function
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US Patent 10288812 Fiber optic-to-waveguide coupling assembly with overlap for edge coupling
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US Patent 11107799 Hybrid system including photonic and electronic integrated circuits and cooling plate
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US Patent 9698564 Hybrid integrated MCM with waveguide-fiber connector
0
US Patent 9933570 Integration of V-grooves on silicon-on-insulator (SOI) platform for direct fiber coupling
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11675136
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Patent Primary Examiner
Eric Wong
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CPC Code
G02B 6/30
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G02B 6/36
0
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