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US Patent 11676930 Nanoparticle backside die adhesion layer
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Patent
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Current Assignee
Texas Instruments
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Date Filed
May 7, 2021
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Date of Patent
June 13, 2023
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Patent Applicant
Texas Instruments
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Patent Application Number
17315102
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Patent Citations
US Patent 8586480 Power MOSFET having selectively silvered pads for clip and bond wire attach
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US Patent 8853006 Method of manufacturing semiconductor device and semiconductor device
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US Patent 9111782 Solderless die attach to a direct bonded aluminum substrate
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US Patent 11031364 Nanoparticle backside die adhesion layer
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US Patent 9397063 Microelectronic packages with nanoparticle joining
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US Patent 7109591 Integrated circuit device
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US Patent 7327039 Nanoparticle filled underfill
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US Patent 7368824 Diffusion solder position, and process for producing it
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US Patent 7476981 Electronic module with layer of adhesive and process for producing it
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US Patent 8555491 Methods of attaching a die to a substrate
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11676930
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Patent Primary Examiner
(Vikki) Hoa B Trinh
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CPC Code
H01L 2224/32058
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H01L 2924/35121
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H01L 24/32
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H01L 24/83
0
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