US Patent 11677472 Hybrid integration of microLED interconnects with ICs
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US Patent 11677472 Hybrid integration of microLED interconnects with ICs
Article
For optical communications between semiconductor ICs, optical transceiver assembly subsystems may be integrated with a processor. The optical transceiver assembly subsystems may be monolithically integrated with processor ICs or they may be provided in separate optical transceiver ICs coupled to or attached to the processor ICs.
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Current Assignee
Patent Jurisdiction
Patent Number
116774720
Date of Patent
June 13, 2023
0Patent Application Number
174615860
Date Filed
August 30, 2021
0Patent Citations
Patent Primary Examiner
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