US Patent 11682551 Wafer structure and trimming method thereof

A wafer structure and a trimming method thereof are provided. The wafer structure includes a first wafer which includes a front surface, a back surface, and a sidewall connected to the front surface and the back surface. The sidewall of the first wafer includes a plurality of first regions at an edge of the sidewall and the back surface and laterally separated from one another by a pitch. Each of the first regions extends from the back surface toward the front surface and has etching streaks thereon.