Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 20, 2023
0Patent Application Number
169836420
Date Filed
August 3, 2020
0Patent Citations
Patent Primary Examiner
CPC Code
Techniques regarding lithographic processes for fabricating Josephson junctions are provided. For example, one or more embodiments described herein can comprise a method that can include depositing a first resist layer onto a second resist layer. The first resist layer can include a bridge portion that defines an opening for forming a Josephson junction. The method can also comprise depositing a third resist layer onto the bridge portion. The third resist layer can shield the opening from an angled deposition of a superconducting material during fabrication of the Josephson junction.
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