A condition monitoring device for monitoring machinery includes a combination of on-board sensors and a condition monitoring module. The on-board sensors include modules for non-contact temperature, magnetic flux and 3-axis vibration sensing of the machinery. The condition monitoring module provides a condition monitoring signal containing information about an operating condition of the machinery, based upon a data synthesis condition monitoring technique that synthesizes non-contact temperature, magnetic flux and 3-axis vibration sensed data received from the combination of on-board sensors, determines a current operating condition of the machinery, and compares the current operating condition and the baseline operating condition of the machinery.