Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 27, 2023
0Patent Application Number
174088490
Date Filed
August 23, 2021
0Patent Citations
Patent Primary Examiner
A chip package structure includes a chip stack and a redistribution layer. The chip stack includes multiple chips stacked together, a molding layer encapsulating the multiple chips, and a vertical conductive element extending from a surface of the molding layer reach and coupled to the bonding pad. Each of the multiple chips includes a bonding pad not covered by the multiple chips. The redistribution layer is above the molding layer and includes a conductive layer coupled to the vertical conductive element, and an insulating layer over and partially exposing the conductive layer.
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