Patent attributes
A radio communication apparatus includes an RF circuit formed on one surface of a printed board and configured to generate an RF signal, a transmission line configured to transmit the RF signal, a transmission line configured to transmit a signal different from the RF signal, a ground layer formed on another surface of the printed board, an antenna element configured to emit the RF signal supplied from the RF circuit through the transmission line, and a connection layer configured to bond together the antenna element and the ground layer. The antenna element includes a plurality of layered dielectric substrates, a metal film formed on surfaces of them, and a through hole formed to penetrate the dielectric substrate closest to the printed board. A part of the transmission line is disposed between any of the plurality of layered dielectric substrates.
