Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11693801 Stacked semiconductor device assembly in computer system

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Current Assignee
Rambus
Rambus
0
Date Filed
April 11, 2022
0
Date of Patent
July 4, 2023
0
Patent Applicant
Rambus
Rambus
0
Patent Application Number
17718168
0
Patent Citations
‌
US Patent 8013448 Multiple selectable function integrated circuit module
0
‌
US Patent 8258619 Integrated circuit die stacks with translationally compatible vias
0
‌
US Patent 8436477 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
0
‌
US Patent 8513817 Memory module in a package
0
‌
US Patent 8558353 Integrated circuit having an uppermost layer comprising landing pads that are distributed thoughout one side of the integrated circuit
0
‌
US Patent 8823162 Integrated circuit die stacks with translationally compatible vias
0
‌
US Patent 8947839 Enhanced immunity from electrostatic discharge
0
‌
US Patent 9171824 Stacked semiconductor device assembly
0
‌
US Patent 9818470 Multi-die memory device
0
‌
US Patent 11398469 Electrostatic discharge (ESD) protection in stacked chips
0
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
11693801
0
Patent Primary Examiner
‌
Henry Tsai
0
CPC Code
‌
G06F 13/362
0
‌
G06F 13/4068
0

Find more entities like US Patent 11693801 Stacked semiconductor device assembly in computer system

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo