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US Patent 11693810 Interface bridge between integrated circuit die
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Patent
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Current Assignee
Intel
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Date Filed
December 24, 2021
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Date of Patent
July 4, 2023
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Patent Applicant
Intel
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Patent Application Number
17561918
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Patent Citations
US Patent 7518398 Integrated circuit with through-die via interface for die stacking
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US Patent 9106229 Programmable interposer circuitry
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11693810
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Patent Primary Examiner
David E Martinez
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CPC Code
H01L 23/52
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H01L 25/0655
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G06F 13/40
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G06F 13/42
0
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