Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 4, 2023
0Patent Application Number
176638110
Date Filed
May 17, 2022
0Patent Citations
Patent Primary Examiner
CPC Code
A method of processing a substrate includes loading the substrate on a substrate holder. The substrate includes a major surface and a feature disposed over the major surface. The feature has a first width along an etch direction. The method includes exposing portions of the major surface and changing the first width of the feature to a second width along the etch direction by etching a first portion of the sidewalls of the feature with a gas cluster ion beam oriented along a beam direction.
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