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Patent Applicant
0
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0
Patent Jurisdiction
Patent Number
Date of Patent
July 11, 2023
0Patent Application Number
177295240
Date Filed
April 26, 2022
0Patent Citations
Patent Primary Examiner
Disclosed herein are techniques for forming a thin-film circuit layer on an array of light-emitting diodes (LEDs). LEDs in the array of LEDs can be singulated by various processes, such as etching and ion implantation. Singulating LEDs can be performed before or after forming the thin-film circuit layer on the array of LEDs. The array of LEDs can be bonded to a transparent or non-transparent substrate.
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