US Patent 11700709 Redundant module and systems for high density servers

The disclosure provides a cooling device, for cooling devices that generate heat during their operation. The cooling device includes single phase cooling plates to be attached to the devices to dissipate a majority of the heat from the devices while a first coolant is circulated through the single phase cooling plates. The cooling device also includes a unified cooling plate. The plate is directly attached on top of the single phase cooling plates. The unified cooling plate dissipates a portion of the heat transferred from the single phase cooling plates to the unified cooling plate while a second coolant is circulated through the unified cooling plate and when the first coolant is insufficient to remove the portion of the heat from at least one of the single phase cooling plates. The cooling device may be used as part of an electronic rack, a data center, and in other environments.