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US Patent 11705425 Thermocompression bond tips and related apparatus and methods

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Current Assignee
Micron Technology
Micron Technology
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Date Filed
April 15, 2021
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Date of Patent
July 18, 2023
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Patent Applicant
Micron Technology
Micron Technology
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Patent Application Number
17301843
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Patent Citations
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US Patent 9576928 Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same
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US Patent 9536857 Heating header of semiconductor mounting apparatus and bonding method for semiconductor
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US Patent 8967452 Thermal compression bonding of semiconductor chips
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US Patent 9093549 Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
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US Patent 9425162 Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
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US Patent 9426898 Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly
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US Patent 9478516 Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11705425
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Patent Primary Examiner
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Edward Chin
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CPC Code
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H01L 24/01
0
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H01L 23/04
0

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