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US Patent 11708264 Stacked-die MEMS resonator

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Current Assignee
SiTime
SiTime
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Date Filed
May 27, 2022
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Date of Patent
July 25, 2023
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Patent Applicant
SiTime
SiTime
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Patent Application Number
17827437
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Patent Citations
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US Patent 7453153 Circuit device
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US Patent 7098517 Semiconductor device
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US Patent 7256669 Method of preparing electrical contacts used in switches
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US Patent 7335872 Photocurrent amplifier circuit and optical pick-up device
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US Patent 7405104 Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same
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US Patent 7419853 Method of fabrication for chip scale package for a micro component
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US Patent 7468552 Physical quantity sensor
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US Patent 7470977 Modular board device, high frequency module, and method of manufacturing same
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US Patent 7691674 Integrated circuit packaging system with stacked device and method of manufacturing thereof
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US Patent 7735368 Acceleration sensor
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•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11708264
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Patent Primary Examiner
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Jose R Diaz
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CPC Code
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H01L 2924/1461
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H01L 23/498
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H01L 23/34
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H01L 2224/48247
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H01L 2224/73265
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B81C 2203/0154
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B81C 2203/0118
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B81C 1/00333
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B81B 7/007
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B81B 7/0083
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•••

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