US Patent 11709790 Spatial distribution in a 3D data processing unit
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US Patent 11709790 Spatial distribution in a 3D data processing unit
Article
The embodiments herein describe a 3D SmartNIC that spatially distributes compute, storage, or network functions in three dimensions using a plurality of layers. That is, unlike current SmartNIC that can perform acceleration functions in a 2D, a 3D Smart can distribute these functions across multiple stacked layers, where each layer can communicate directly or indirectly with the other layers.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
117097900
Date of Patent
July 25, 2023
0Patent Application Number
171844560
Date Filed
February 24, 2021
0Patent Citations
Patent Primary Examiner
CPC Code
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