Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 25, 2023
0Patent Application Number
174017190
Date Filed
August 13, 2021
0Patent Citations
...
Patent Primary Examiner
CPC Code
A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.
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