Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 1, 2023
0Patent Application Number
168375070
Date Filed
April 1, 2020
0Patent Citations Received
Patent Primary Examiner
CPC Code
In accordance with some embodiments, a method for processing semiconductor wafer is provided. The method includes connecting a drum which stores the chemical liquid with a testing pipe. The method also includes guiding the chemical liquid in the drum into the testing pipe. In addition, the method includes detecting a condition of the chemical liquid in the testing pipe. The method further includes determining if the condition of the chemical liquid is acceptable. When the condition of the chemical liquid is acceptable, supplying the chemical liquid to a processing tool at which the semiconductor wafer is processed.
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