Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
August 1, 2023
0Patent Application Number
171193820
Date Filed
December 11, 2020
0Patent Citations
Patent Primary Examiner
Embodiments of the present disclosure are related to carrier assemblies that can clamp more than one optical device substrates and methods for forming the carrier assemblies. The carrier assembly includes a carrier, one or more substrates, and a mask. The carrier is magnetically coupled to the mask to retain the one or more substrates. The carrier assembly is used for supporting and transporting the one or more substrates during processing. The carrier assembly is also used for masking the one or more substrates during PVD processing. Methods for assembling the carrier assembly in a build chamber are described herein.
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