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US Patent 11749563 Interlayer dielectric layer

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
September 21, 2018
Date of Patent
September 5, 2023
Patent Application Number
16138106
Patent Citations
‌
US Patent 7482265 UV curing of low-k porous dielectrics
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US Patent 7855142 Methods of forming dual-damascene metal interconnect structures using multi-layer hard masks
‌
US Patent 7288292 Ultra low k (ULK) SiCOH film and method
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US Patent 7485582 Hardmask for improved reliability of silicon based dielectrics
Patent Inventor Names
Joung-Wei Liou
Bo-Jhih Shen
Yi-Wei Chiu
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11749563
Patent Primary Examiner
‌
Shih Tsun A Chou
CPC Code
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H01L 23/53295
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H01L 21/76802
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H01L 21/76877
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H01L 21/02274
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H01L 21/76826
‌
H01L 21/76828
‌
H01L 21/76829

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