Patent attributes
A power-converter module has a switching Printed Circuit Board (PCB) with power transistors that generate heat. Ground, an input power supply, and an output power supply to the power transistors connect through metal traces on the switching PCB directly to interposer heat sinks that are soldered between the switching PCB and a system PCB. The metal traces and interposer heat sinks carry both supply or ground currents and heat away from the power transistors. These power and ground currents continue from the interposer heat sinks to the system PCB through direct solder joints between the system PCB and the interposer heat sinks. An interposer PCB has a same thickness as the interposer heat sinks and carries control signals from the system PCB to the switching PCB, bypassing the interposer heat sinks. The interposer heat sinks have an interposer portion soldered between the PCBs and fins beyond the switching PCB footprint.
