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US Patent 11751365 Jet impingement manifolds for cooling power electronics modules

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Inventor Names

Paul Philip Paret

Ramchandra Mahendrabhai Kotecha

Sreekant Venkat Jagannath Narumanchi

Kevin Scott Bennion

Xuhui Feng

Gilberto Moreno

Date of Patent

September 5, 2023

Patent Application Number

17084236

Date Filed

October 29, 2020

Patent Citations

US Patent 9437523 Two-sided jet impingement assemblies and power electronics modules comprising the same

US Patent 9445526 Modular jet impingement assemblies with passive and active flow control for electronics cooling

US Patent 10270220 Methods and systems for heat flux heat removal

US Patent 9980415 Configurable double-sided modular jet impingement assemblies for electronics cooling

US Patent 10278305 Electronic assembly with phase-change cooling of a semiconductor device

US Patent 7190580 Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages

US Patent 8699225 Liquid cooled electronics assembly suitable to use electrically conductive coolant

Patent Primary Examiner

CPC Code

The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.

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