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US Patent 11752517 Hotmelt application system and process

Patent 11752517 was granted and assigned to C3 Corporation on September, 2023 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Current Assignee

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C3 Corporation

Date Filed

July 27, 2022

Date of Patent

September 12, 2023

Patent Applicant

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C3 Corporation

Patent Application Number

17874510

Patent Citations

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US Patent 8784935 Hot melt adhesive system and method using machine readable information

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US Patent 8936178 Adhesive melter having quick change pump pack assembly and associated methods

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US Patent 9296009 Adhesive dispensing system having metering system including variable frequency drive and closed-loop feedback control

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US Patent 9481007 Method and system for regulating adhesive application

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US Patent 10046351 Material dispense tracking and control

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US Patent 10099243 Adhesive dispensing device having optimized reservoir and capacitive level sensor

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US Patent 10213806 Melter for supplying liquid adhesive

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US Patent 10661294 Material dispense tracking and control

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US Patent 10596588 Adhesive melter having pump mounted into heated housing

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US Patent RE39399 Segmented die for applying hot melt adhesives or other polymer melts

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Patent Inventor Names

Grant D. Daniels

Jeffery J. VanHandel

Scott S. Ebben

Alex N. Kuffel

Joseph F. Van De Hey

Alex M. Zirbel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

11752517

Patent Primary Examiner

CPC Code

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