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US Patent 11752529 Method for cleaning semiconductor wafers

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
November 15, 2017
Date of Patent
September 12, 2023
Patent Application Number
15814246
Patent Citations
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US Patent 7306002 System and method for wet cleaning a semiconductor wafer
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US Patent 7495371 Cleaning tank with sleeved ultrasonic transducer
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US Patent 7598654 Megasonic processing apparatus with frequency sweeping of thickness mode transducers
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US Patent 8310131 Megasonic processing apparatus with frequency sweeping of thickness mode transducers
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US Patent 8936032 Ultrasonic air blanket reflector
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US Patent 8585825 Acoustic assisted single wafer wet clean for semiconductor wafer process
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US Patent 9159311 Unrestricted mounting of ultrasonic transducers
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US Patent 7119019 Capping of copper structures in hydrophobic ILD using aqueous electro-less bath
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US Patent 7247977 Ultrasonic processing method and apparatus with multiple frequency transducers
Patent Inventor Names
Hui Wang
Zhaowei Jia
Jian Wang
Xuejun Li
Fufa Chen
Liangzhi Xie
Xi Wang
Yinuo Jin
Xiaoyan Zhang
Fuping Chen
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11752529
Patent Primary Examiner
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Douglas Lee
CPC Code
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H01L 21/68764
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H01L 21/67051
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H01L 21/02052
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G08B 25/08
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G08B 21/182
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B08B 3/12
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B08B 3/08
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B08B 1/007
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B06B 3/02
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B06B 3/00
•••

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