US Patent 11754444 Distributed integrate and dump circuit
Patent 11754444 was granted and assigned to Rockwell Collins on September, 2023 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
March 19, 2021
Date of Patent
September 12, 2023
Patent Applicant
Patent Application Number
17207599
Patent Citations
Patent Inventor Names
Wenlu Chen
Han Chi Hsieh
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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