US Patent 11756790 Method for patterning a dielectric layer

A method is described for patterning a dielectric layer disposed over a semiconductor substrate layer. The patterning process includes forming a patterned hard mask layer over the dielectric layer, the patterned hard mask layer exposing a portion of a major surface of the dielectric layer. A portion of the dielectric layer is removed by a cyclic etch process, where performing one cycle of the cyclic etch process comprises forming a capping layer selectively over the patterned hard mask layer and performing a timed etch process that removes material from the dielectric layer. In another method, the deposition over the hard mask and the removal of the portion of the dielectric layer are performed concurrently.