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US Patent 11756899 Lead frame surface finishing

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
May 17, 2021
Date of Patent
September 12, 2023
Patent Application Number
17322712
Patent Citations
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US Patent 7368326 Methods and apparatus to reduce growth formations on plated conductive leads
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US Patent 7391116 Fretting and whisker resistant coating system and method
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US Patent 7788800 Method for fabricating a leadframe
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US Patent 9059185 Copper leadframe finish for copper wire bonding
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US Patent 9653385 Lead frame
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US Patent 10665533 Lead frame and semiconductor device
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US Patent 9679832 Rough leadframe with a nanolayer of silver
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US Patent 11011476 Lead frame surface finishing
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US Patent 7148085 Gold spot plated leadframes for semiconductor devices and method of fabrication
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US Patent 7190057 Packaging component and semiconductor package
Patent Inventor Names
Jürgen Barthelmes
Paolo Crema
Din-Ghee Neoh
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11756899
Patent Primary Examiner
‌
Alonzo Chambliss
CPC Code
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H01L 23/49541
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H01L 21/4825
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H01L 23/49582
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C25D 5/611
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C25D 5/605
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C25D 3/38
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C25D 5/10
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C25D 5/48
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C25D 7/00
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H01L 23/4952
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